Screen Mask

Differentiated TOTAL SOLUTION TECHNOLOGY
We provide various services based on 4 core technologies.

Overview

Precision printing using Stainless Steel (SUS) Mesh instead of general Polyester Mesh. It is used for precise printing requiring finer pattern such as semiconductor, LCD, OLED, MLCC, solar cell, Ag electrode, and transparent electrode, etc.

This technology enables it to apply SUS Mesh directly to have a certain tension, apply a sensitizer on the SUS Mesh, expose it to the light through photomask to form a fine pattern, and then develop to open only the desired patterned part.

Application

  • Smart phone
  • Wearable
  • Flexible
  • Hydrogen vehicle
  • Alternative energy

Specification

MaterialSUS Mesh 250, 325, 350, 400, 500, etc. CAL Mesh
SUS Mesh Thickness15 mu m, 20 mu m, 30 mu m, 35 mu m, 40 mu m, 50 mu m, etc.
Thickness Precision± 5%
Processing Precision± 10㎛
Minimum Openingminimum 60㎛
Emulsion Thickness5㎛ ~ 30㎛
Min Line Widthminimum 20㎛
Applied ProductsSemi-conductor, LED PKG, MLCC, LTCC chip parts
OLED, LCD, solar cell electrode printing, etc.
Deliverywithin 3 days
Frame Size320mm × 320mm or 550mm × 550mm, etc.
Draining of PasteExcellent (It can replace Hybrid Mask if necessary)
Feature Photo-mask is manufactured after designing Auto CAD
Dimensional stability, High resolution
Alternative technology E-FORM Mask , Hybrid Mask
Applied Fields Displays, Semi-conductor, Chip electronic parts, Electrode printing

Characteristic

  • Photo-mask is manufactured after designing Auto CAD

  • Dimensional stability

  • High resolution

Electroforming Products

Metal Mask

Ni + Co Alloy Plating
SMT(Surface Mounting), Integrated circuit

COB Mask

Ni + Co Alloy Plating
Chip On Board(COB)

Flip Chip

SUS 316
Flip Chip, Wafer Ball

Wafer Mask

Ni + Co Alloy Plating
Wafer Ball(300mm)

Wafer Mask

Ni + Co Alloy Plating
Wafer Flux(300mm)

Wafer Mask

Ni + Co Alloy Plating
Wafer LED(100mm)

Metal Mask

Ni + Co Alloy Plating
Chip Package

Double Layer Mask

Ni + Co Alloy Plating
Electronics

Nickel Mesh

Ni + Co Alloy Plating
Cleantech or Food Industry

Micro Sieve

Ni + Co Alloy Plating
Solder Ball, Powder

Shadow Mask

Ni + Co Alloy Plating
Electronics

Others

Ni + Co Alloy Plating
Others