Hybrid Mask

Differentiated TOTAL SOLUTION TECHNOLOGY
We provide various services based on 4 core technologies.

Overview

Ultra-precision metal mask combining conventional existing screen mask and electroforming mask

Application

  • Smart phone
  • Wearable
  • Flexible
  • Hydrogen vehicle
  • Alternative energy

Specification

Feature Excellent durability compared to the conventional screen mask (10 times or more)
For SUS Mask, nickel plating membrane replaces emulsion membrane
Excellent printability and removability, flat
Straight printing without damaging prints
Possible to print very thick paste on minute line width
Applied Fields Solar cell, touch screen, POP/LCD, OLED,etc.
MLCC, LTCC, EM, MESH filter, etc.
Other electrode printing

Electroforming Products

Metal Mask

Ni + Co Alloy Plating
SMT(Surface Mounting), Integrated circuit

COB Mask

Ni + Co Alloy Plating
Chip On Board(COB)

Flip Chip

SUS 316
Flip Chip, Wafer Ball

Wafer Mask

Ni + Co Alloy Plating
Wafer Ball(300mm)

Wafer Mask

Ni + Co Alloy Plating
Wafer Flux(300mm)

Wafer Mask

Ni + Co Alloy Plating
Wafer LED(100mm)

Metal Mask

Ni + Co Alloy Plating
Chip Package

Double Layer Mask

Ni + Co Alloy Plating
Electronics

Nickel Mesh

Ni + Co Alloy Plating
Cleantech or Food Industry

Micro Sieve

Ni + Co Alloy Plating
Solder Ball, Powder

Shadow Mask

Ni + Co Alloy Plating
Electronics

Others

Ni + Co Alloy Plating
Others